Fabrication and characterisation of low temperature bonding via copper nanowire arrays

• المؤلف الرئيسي: Nadia Eddy Razali
• مؤلفون آخرون: Gan Chee Lip
• التنسيق: Final Year Project
• اللغة: English
• منشور في: 2011
• الموضوعات: DRNTU::Engineering
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/44553
• المؤسسة: Nanyang Technological University

This research involves the electrical and mechanical characterization of thermocompressionally bonded copper nanowires. Copper nanowires were fabricated via electrodeposition into anodic alumina oxide (AAO) templates. Electrodeposited samples were then diced into 1 mm by 1 mm chips before thermocomp...