Fabrication and characterisation of low temperature bonding via copper nanowire arrays

This research involves the electrical and mechanical characterization of thermocompressionally bonded copper nanowires. Copper nanowires were fabricated via electrodeposition into anodic alumina oxide (AAO) templates. Electrodeposited samples were then diced into 1 mm by 1 mm chips before thermocomp...

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Bibliographic Details
Main Author: Nadia Eddy Razali
Other Authors: Gan Chee Lip
Format: Final Year Project
Language:English
Published: 2011
Subjects:
Online Access:http://hdl.handle.net/10356/44553
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Institution: Nanyang Technological University
Language: English