Fabrication and characterisation of low temperature bonding via copper nanowire arrays
This research involves the electrical and mechanical characterization of thermocompressionally bonded copper nanowires. Copper nanowires were fabricated via electrodeposition into anodic alumina oxide (AAO) templates. Electrodeposited samples were then diced into 1 mm by 1 mm chips before thermocomp...
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| 格式: | Final Year Project |
| 語言: | English |
| 出版: |
2011
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| 在線閱讀: | http://hdl.handle.net/10356/44553 |
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| 機構: | Nanyang Technological University |
| 語言: | English |