Application of V(Z) curve technique to study the elastic properties of various layers and detection of defects of a 3D wafer

• 主要作者: Tan, Andrew Yong Sheng.
• 其他作者: Wong, Brian Stephen
• 格式: Final Year Project
• 語言: English
• 出版: 2011
• 主題: DRNTU::Engineering::Mechanical engineering
• 在線閱讀: http://hdl.handle.net/10356/44961

Electronic products are getting more compacted as technology of wafer fabrication advances. In addition, 3D wafer is seen by many as the next “popular technology” in the industry; due to its many advantages that this technology possesses. As new development progress, thinner layers are produced i...