Application of V(Z) curve technique to study the elastic properties of various layers and detection of defects of a 3D wafer
Electronic products are getting more compacted as technology of wafer fabrication advances. In addition, 3D wafer is seen by many as the next “popular technology” in the industry; due to its many advantages that this technology possesses. As new development progress, thinner layers are produced i...
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| Format: | Final Year Project |
| Language: | English |
| Published: |
2011
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| Online Access: | http://hdl.handle.net/10356/44961 |
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| Institution: | Nanyang Technological University |
| Language: | English |