Application of V(Z) curve technique to study the elastic properties of various layers and detection of defects of a 3D wafer

• المؤلف الرئيسي: Tan, Andrew Yong Sheng.
• مؤلفون آخرون: Wong, Brian Stephen
• التنسيق: Final Year Project
• اللغة: English
• منشور في: 2011
• الموضوعات: DRNTU::Engineering::Mechanical engineering
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/44961
• المؤسسة: Nanyang Technological University

Electronic products are getting more compacted as technology of wafer fabrication advances. In addition, 3D wafer is seen by many as the next “popular technology” in the industry; due to its many advantages that this technology possesses. As new development progress, thinner layers are produced i...