Advanced planarization techniques for deep sub-micron applications
In this work, the evolution of step height, film thickness and unformity, on both the STI test structures and SDRAM structure throughout the CMP process were characterized in detailed. Comparision made among the newly proposed scheme and the conventional processes such as Direct Polish (DP) Scheme a...
Saved in:
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Theses and Dissertations |
| Published: |
2008
|
| Subjects: | |
| Online Access: | http://hdl.handle.net/10356/4685 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Institution: | Nanyang Technological University |
| Summary: | In this work, the evolution of step height, film thickness and unformity, on both the STI test structures and SDRAM structure throughout the CMP process were characterized in detailed. Comparision made among the newly proposed scheme and the conventional processes such as Direct Polish (DP) Scheme and the Reverse Mask (RT) Scheme were also presented. |
|---|