Advanced planarization techniques for deep sub-micron applications

• Main Author: Lim, Victor Seng Keong.
• Other Authors: Goh, Wang Ling
• Format: Theses and Dissertations
• Published: 2008
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
• Online Access: http://hdl.handle.net/10356/4685
• Institution: Nanyang Technological University

In this work, the evolution of step height, film thickness and unformity, on both the STI test structures and SDRAM structure throughout the CMP process were characterized in detailed. Comparision made among the newly proposed scheme and the conventional processes such as Direct Polish (DP) Scheme a...