Study of copper diffusion in tantalum based barrier materials
This thesis presents our findings on Cu diffusion into different potential barrier layers.
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2008
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sg-ntu-dr.10356-47942023-07-04T16:02:12Z Study of copper diffusion in tantalum based barrier materials Loh, Seow Wee. Zhang, Dao Hua School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Electric apparatus and materials This thesis presents our findings on Cu diffusion into different potential barrier layers. Doctor of Philosophy (EEE) 2008-09-17T09:58:49Z 2008-09-17T09:58:49Z 2004 2004 Thesis http://hdl.handle.net/10356/4794 Nanyang Technological University application/pdf |
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DRNTU::Engineering::Electrical and electronic engineering::Electric apparatus and materials Loh, Seow Wee. Study of copper diffusion in tantalum based barrier materials |
description |
This thesis presents our findings on Cu diffusion into different potential barrier layers. |
author2 |
Zhang, Dao Hua |
author_facet |
Zhang, Dao Hua Loh, Seow Wee. |
format |
Theses and Dissertations |
author |
Loh, Seow Wee. |
author_sort |
Loh, Seow Wee. |
title |
Study of copper diffusion in tantalum based barrier materials |
title_short |
Study of copper diffusion in tantalum based barrier materials |
title_full |
Study of copper diffusion in tantalum based barrier materials |
title_fullStr |
Study of copper diffusion in tantalum based barrier materials |
title_full_unstemmed |
Study of copper diffusion in tantalum based barrier materials |
title_sort |
study of copper diffusion in tantalum based barrier materials |
publishDate |
2008 |
url |
http://hdl.handle.net/10356/4794 |
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1772828088396152832 |