Study of copper diffusion in tantalum based barrier materials

This thesis presents our findings on Cu diffusion into different potential barrier layers.

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Bibliographic Details
Main Author: Loh, Seow Wee.
Other Authors: Zhang, Dao Hua
Format: Theses and Dissertations
Published: 2008
Subjects:
Online Access:http://hdl.handle.net/10356/4794
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Institution: Nanyang Technological University
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spelling sg-ntu-dr.10356-47942023-07-04T16:02:12Z Study of copper diffusion in tantalum based barrier materials Loh, Seow Wee. Zhang, Dao Hua School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Electric apparatus and materials This thesis presents our findings on Cu diffusion into different potential barrier layers. Doctor of Philosophy (EEE) 2008-09-17T09:58:49Z 2008-09-17T09:58:49Z 2004 2004 Thesis http://hdl.handle.net/10356/4794 Nanyang Technological University application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
topic DRNTU::Engineering::Electrical and electronic engineering::Electric apparatus and materials
spellingShingle DRNTU::Engineering::Electrical and electronic engineering::Electric apparatus and materials
Loh, Seow Wee.
Study of copper diffusion in tantalum based barrier materials
description This thesis presents our findings on Cu diffusion into different potential barrier layers.
author2 Zhang, Dao Hua
author_facet Zhang, Dao Hua
Loh, Seow Wee.
format Theses and Dissertations
author Loh, Seow Wee.
author_sort Loh, Seow Wee.
title Study of copper diffusion in tantalum based barrier materials
title_short Study of copper diffusion in tantalum based barrier materials
title_full Study of copper diffusion in tantalum based barrier materials
title_fullStr Study of copper diffusion in tantalum based barrier materials
title_full_unstemmed Study of copper diffusion in tantalum based barrier materials
title_sort study of copper diffusion in tantalum based barrier materials
publishDate 2008
url http://hdl.handle.net/10356/4794
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