Study of copper diffusion in tantalum based barrier materials
This thesis presents our findings on Cu diffusion into different potential barrier layers.
Saved in:
Main Author: | Loh, Seow Wee. |
---|---|
Other Authors: | Zhang, Dao Hua |
Format: | Theses and Dissertations |
Published: |
2008
|
Subjects: | |
Online Access: | http://hdl.handle.net/10356/4794 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | Nanyang Technological University |
Similar Items
-
Tantalum-based diffusion barriers for copper metallization
by: Khin Maung Latt.
Published: (2008) -
Effects of copper diffusion on the performance of MOS devices
by: Tee, Kheng Chok.
Published: (2008) -
Tantalum based amorphous thin films as copper diffusion barrier
by: Yan, Hua
Published: (2013) -
Dielectric/metal diffusion barrier in Cu/porous ultra low-k interconnect technology
by: Chen, Zhe
Published: (2008) -
Electrochemical plated copper for interconnect applications
by: Loh, Stephen Soon Ann.
Published: (2008)