Self-aligned dual damascene processing technique to improve copper interconnect performance

Improving the process and reliability of copper via-line metallization using a proposed novel self-aligned dual damascene approach for the 0.13 urn technology generation. Collective process issues when implementing industrial primary DD approaches led to the invention of the DD approach.

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Bibliographic Details
Main Author:	Neo, Chin Chuan
Other Authors:	Goh, Wang Ling
Format:	Theses and Dissertations
Published:	2008
Subjects:	DRNTU::Engineering::Electrical and electronic engineering
Online Access:	http://hdl.handle.net/10356/4931
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Institution:	Nanyang Technological University

id	sg-ntu-dr.10356-4931
record_format	dspace
spelling	sg-ntu-dr.10356-49312023-07-04T16:28:27Z Self-aligned dual damascene processing technique to improve copper interconnect performance Neo, Chin Chuan Goh, Wang Ling School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering Improving the process and reliability of copper via-line metallization using a proposed novel self-aligned dual damascene approach for the 0.13 urn technology generation. Collective process issues when implementing industrial primary DD approaches led to the invention of the DD approach. Master of Engineering 2008-09-17T10:01:42Z 2008-09-17T10:01:42Z 2004 2004 Thesis http://hdl.handle.net/10356/4931 Nanyang Technological University application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
topic	DRNTU::Engineering::Electrical and electronic engineering
spellingShingle	DRNTU::Engineering::Electrical and electronic engineering Neo, Chin Chuan Self-aligned dual damascene processing technique to improve copper interconnect performance
description	Improving the process and reliability of copper via-line metallization using a proposed novel self-aligned dual damascene approach for the 0.13 urn technology generation. Collective process issues when implementing industrial primary DD approaches led to the invention of the DD approach.
author2	Goh, Wang Ling
author_facet	Goh, Wang Ling Neo, Chin Chuan
format	Theses and Dissertations
author	Neo, Chin Chuan
author_sort	Neo, Chin Chuan
title	Self-aligned dual damascene processing technique to improve copper interconnect performance
title_short	Self-aligned dual damascene processing technique to improve copper interconnect performance
title_full	Self-aligned dual damascene processing technique to improve copper interconnect performance
title_fullStr	Self-aligned dual damascene processing technique to improve copper interconnect performance
title_full_unstemmed	Self-aligned dual damascene processing technique to improve copper interconnect performance
title_sort	self-aligned dual damascene processing technique to improve copper interconnect performance
publishDate	2008
url	http://hdl.handle.net/10356/4931
_version_	1772826245166268416

Self-aligned dual damascene processing technique to improve copper interconnect performance

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