Back-end-of-line process reliability of advanced semiconductor technology

• 主要作者: Park, Hun Sub.
• 其他作者: School of Materials Science & Engineering
• 格式: Research Report
• 語言: English
• 出版: 2008
• 主題: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
• 在線閱讀: http://hdl.handle.net/10356/5036

The main objectives of this project are (1) to establish new test procedures for accurate wafer-level characterization of Cu electromigration behavior and low-k dielectric materials, (2) to measure the wafer-level Cu electromigration characteristics and explain them in terms of microstructural chang...