Surface chemical study on the oxidation resistance of plasma-treated copper

In this article, we have also demonstrated the use of XPS, AES, FTIR, RS, XRD, TEM, FE-SEM for studying copper oxidation and, for the first time, studied the surface chemistry and oxidation-resistance of the C, N and Cu-containing films.

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Bibliographic Details
Main Author: Wong, Andrew See Weng.
Other Authors: Sakar, G.
Format: Theses and Dissertations
Published: 2008
Subjects:
Online Access:http://hdl.handle.net/10356/5054
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Institution: Nanyang Technological University

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