Surface chemical study on the oxidation resistance of plasma-treated copper
In this article, we have also demonstrated the use of XPS, AES, FTIR, RS, XRD, TEM, FE-SEM for studying copper oxidation and, for the first time, studied the surface chemistry and oxidation-resistance of the C, N and Cu-containing films.
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Main Author: | Wong, Andrew See Weng. |
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Other Authors: | Sakar, G. |
Format: | Theses and Dissertations |
Published: |
2008
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Subjects: | |
Online Access: | http://hdl.handle.net/10356/5054 |
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Institution: | Nanyang Technological University |
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