Anisotropic conductive adhesive for micro joining in semiconductor interconnects application (solder alternative for fine pitch & environment friendly IC packaging)

Microelectronic packaging has been accelerating towards adoption of novel solutions that offer lower cost, higher electrical performance, and better reliability. Flip chip technology lends itself excellently to these goals. The development of anisotropic and isotropic conductive adhesives (ACA &...

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Bibliographic Details
Main Author: Goh, Chin Foo
Other Authors: Boey Yin Chiang, Freddy
Format: Theses and Dissertations
Language:English
Published: 2008
Subjects:
Online Access:https://hdl.handle.net/10356/5089
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Institution: Nanyang Technological University
Language: English
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