Anisotropic conductive adhesive for micro joining in semiconductor interconnects application (solder alternative for fine pitch & environment friendly IC packaging)

• Main Author: Goh, Chin Foo
• Other Authors: Boey Yin Chiang, Freddy
• Format: Theses and Dissertations
• Language: English
• Published: 2008
• Subjects: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
• Online Access: https://hdl.handle.net/10356/5089
• Institution: Nanyang Technological University

Microelectronic packaging has been accelerating towards adoption of novel solutions that offer lower cost, higher electrical performance, and better reliability. Flip chip technology lends itself excellently to these goals. The development of anisotropic and isotropic conductive adhesives (ACA &...