Anisotropic conductive adhesive for micro joining in semiconductor interconnects application (solder alternative for fine pitch & environment friendly IC packaging)

• المؤلف الرئيسي: Goh, Chin Foo
• مؤلفون آخرون: Boey Yin Chiang, Freddy
• التنسيق: Theses and Dissertations
• اللغة: English
• منشور في: 2008
• الموضوعات: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/5089

Microelectronic packaging has been accelerating towards adoption of novel solutions that offer lower cost, higher electrical performance, and better reliability. Flip chip technology lends itself excellently to these goals. The development of anisotropic and isotropic conductive adhesives (ACA &...