Anisotropic conductive adhesive for micro joining in semiconductor interconnects application (solder alternative for fine pitch & environment friendly IC packaging)
Microelectronic packaging has been accelerating towards adoption of novel solutions that offer lower cost, higher electrical performance, and better reliability. Flip chip technology lends itself excellently to these goals. The development of anisotropic and isotropic conductive adhesives (ACA &...
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| 格式: | Theses and Dissertations |
| 語言: | English |
| 出版: |
2008
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| 主題: | |
| 在線閱讀: | https://hdl.handle.net/10356/5089 |
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| 機構: | Nanyang Technological University |
| 語言: | English |