Tantalum based amorphous thin films as copper diffusion barrier
This dissertation presents a study of Ta-based Cu diffusion barrier for advanced semiconductor technology. With the fast development of semiconductor industry, a novel barrier is required in order to address two challenges in the back-end-of-line technology: enhancing the interconnect reliability of...
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| 格式: | Theses and Dissertations |
| 語言: | English |
| 出版: |
2013
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| 主題: | |
| 在線閱讀: | https://hdl.handle.net/10356/51780 |
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