Compositional dependence of Sn-Zn solder on the intermetallic compound (IMC) growth kinetics with Cu at thin film scales
The development of lead-free solders in microelectronics packaging industry attracts both manufacturers and researchers to study the effect of alloying elements to the reliability of solder joint. One of the most important factors to be examined is the growth of intermetallic compound (IMC) layer in...
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| 格式: | Final Year Project |
| 語言: | English |
| 出版: |
2013
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| 在線閱讀: | http://hdl.handle.net/10356/52244 |
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| 機構: | Nanyang Technological University |
| 語言: | English |