Characterization of aluminium pad under different process conditions

• 主要作者: Wang, Jian Hua.
• 其他作者: Zhong, Zhaowei
• 格式: Theses and Dissertations
• 出版: 2008
• 主題: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films
• 在線閱讀: http://hdl.handle.net/10356/5340

The objective of this study is to improve the aluminum film uniformity by optimizing the process condition. The aluminum film was deposited by a sputtering process on 200mm wafers in AMAT Endura® PVD chambers.