Precision crack-off method for silicon wafering
Silicon is widely used in fabricating silicon wafers for electronics which are used in our daily life. However, the current method of using diamond wire-sawing method to fabricate silicon wafer is still too time consuming and produces almost 50% of wastage due to the high kerf loss of the diamond wi...
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| Format: | Final Year Project |
| Language: | English |
| Published: |
2013
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| Online Access: | http://hdl.handle.net/10356/54031 |
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| Institution: | Nanyang Technological University |
| Language: | English |