Precision crack-off method for silicon wafering

Silicon is widely used in fabricating silicon wafers for electronics which are used in our daily life. However, the current method of using diamond wire-sawing method to fabricate silicon wafer is still too time consuming and produces almost 50% of wastage due to the high kerf loss of the diamond wi...

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Main Author: Tan, Gary Wei Liang.
Other Authors: Sathyan Subbiah
Format: Final Year Project
Language:English
Published: 2013
Subjects:
Online Access:http://hdl.handle.net/10356/54031
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-540312023-03-04T18:32:22Z Precision crack-off method for silicon wafering Tan, Gary Wei Liang. Sathyan Subbiah School of Mechanical and Aerospace Engineering DRNTU::Engineering Silicon is widely used in fabricating silicon wafers for electronics which are used in our daily life. However, the current method of using diamond wire-sawing method to fabricate silicon wafer is still too time consuming and produces almost 50% of wastage due to the high kerf loss of the diamond wire. In this project, an alternative process using the precision crack-off method to wafer silicon block was being studied. With a similar study on glass rod (BK-7) which produced promising results using this method, the author venture further to use the precision crack-off method on silicon block. Modifications were done to the design of the experiment setup and new feature was being explored such as implementing notches all around the silicon block to produce a better surface finishing. Through the data collected, this project offers exciting possibilities of using precision crack-off method as an alternative process to slice silicon ingot in its single crystalline structure. Bachelor of Engineering (Mechanical Engineering) 2013-06-11T08:58:30Z 2013-06-11T08:58:30Z 2013 2013 Final Year Project (FYP) http://hdl.handle.net/10356/54031 en Nanyang Technological University 82 p. application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic DRNTU::Engineering
spellingShingle DRNTU::Engineering
Tan, Gary Wei Liang.
Precision crack-off method for silicon wafering
description Silicon is widely used in fabricating silicon wafers for electronics which are used in our daily life. However, the current method of using diamond wire-sawing method to fabricate silicon wafer is still too time consuming and produces almost 50% of wastage due to the high kerf loss of the diamond wire. In this project, an alternative process using the precision crack-off method to wafer silicon block was being studied. With a similar study on glass rod (BK-7) which produced promising results using this method, the author venture further to use the precision crack-off method on silicon block. Modifications were done to the design of the experiment setup and new feature was being explored such as implementing notches all around the silicon block to produce a better surface finishing. Through the data collected, this project offers exciting possibilities of using precision crack-off method as an alternative process to slice silicon ingot in its single crystalline structure.
author2 Sathyan Subbiah
author_facet Sathyan Subbiah
Tan, Gary Wei Liang.
format Final Year Project
author Tan, Gary Wei Liang.
author_sort Tan, Gary Wei Liang.
title Precision crack-off method for silicon wafering
title_short Precision crack-off method for silicon wafering
title_full Precision crack-off method for silicon wafering
title_fullStr Precision crack-off method for silicon wafering
title_full_unstemmed Precision crack-off method for silicon wafering
title_sort precision crack-off method for silicon wafering
publishDate 2013
url http://hdl.handle.net/10356/54031
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