Precision crack-off method for silicon wafering
Silicon is widely used in fabricating silicon wafers for electronics which are used in our daily life. However, the current method of using diamond wire-sawing method to fabricate silicon wafer is still too time consuming and produces almost 50% of wastage due to the high kerf loss of the diamond wi...
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sg-ntu-dr.10356-540312023-03-04T18:32:22Z Precision crack-off method for silicon wafering Tan, Gary Wei Liang. Sathyan Subbiah School of Mechanical and Aerospace Engineering DRNTU::Engineering Silicon is widely used in fabricating silicon wafers for electronics which are used in our daily life. However, the current method of using diamond wire-sawing method to fabricate silicon wafer is still too time consuming and produces almost 50% of wastage due to the high kerf loss of the diamond wire. In this project, an alternative process using the precision crack-off method to wafer silicon block was being studied. With a similar study on glass rod (BK-7) which produced promising results using this method, the author venture further to use the precision crack-off method on silicon block. Modifications were done to the design of the experiment setup and new feature was being explored such as implementing notches all around the silicon block to produce a better surface finishing. Through the data collected, this project offers exciting possibilities of using precision crack-off method as an alternative process to slice silicon ingot in its single crystalline structure. Bachelor of Engineering (Mechanical Engineering) 2013-06-11T08:58:30Z 2013-06-11T08:58:30Z 2013 2013 Final Year Project (FYP) http://hdl.handle.net/10356/54031 en Nanyang Technological University 82 p. application/pdf |
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DRNTU::Engineering Tan, Gary Wei Liang. Precision crack-off method for silicon wafering |
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Silicon is widely used in fabricating silicon wafers for electronics which are used in our daily life. However, the current method of using diamond wire-sawing method to fabricate silicon wafer is still too time consuming and produces almost 50% of wastage due to the high kerf loss of the diamond wire.
In this project, an alternative process using the precision crack-off method to wafer silicon block was being studied. With a similar study on glass rod (BK-7) which produced promising results using this method, the author venture further to use the precision crack-off method on silicon block. Modifications were done to the design of the experiment setup and new feature was being explored such as implementing notches all around the silicon block to produce a better surface finishing.
Through the data collected, this project offers exciting possibilities of using precision crack-off method as an alternative process to slice silicon ingot in its single crystalline structure. |
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Sathyan Subbiah |
author_facet |
Sathyan Subbiah Tan, Gary Wei Liang. |
format |
Final Year Project |
author |
Tan, Gary Wei Liang. |
author_sort |
Tan, Gary Wei Liang. |
title |
Precision crack-off method for silicon wafering |
title_short |
Precision crack-off method for silicon wafering |
title_full |
Precision crack-off method for silicon wafering |
title_fullStr |
Precision crack-off method for silicon wafering |
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Precision crack-off method for silicon wafering |
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precision crack-off method for silicon wafering |
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2013 |
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http://hdl.handle.net/10356/54031 |
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1759855383110746112 |