Precision crack-off method for silicon wafering

• Main Author: Tan, Gary Wei Liang.
• Other Authors: Sathyan Subbiah
• Format: Final Year Project
• Language: English
• Published: 2013
• Subjects: DRNTU::Engineering
• Online Access: http://hdl.handle.net/10356/54031
• Institution: Nanyang Technological University

Silicon is widely used in fabricating silicon wafers for electronics which are used in our daily life. However, the current method of using diamond wire-sawing method to fabricate silicon wafer is still too time consuming and produces almost 50% of wastage due to the high kerf loss of the diamond wi...