Development of compact thermal models for advanced electronic packages
This study is aimed at developing compact models for advanced electronic packages, such as an area array e.g. Ball Grid Array (BGA), or flip chip type packages.
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| Format: | Theses and Dissertations |
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2008
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| Online Access: | http://hdl.handle.net/10356/5419 |
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| Institution: | Nanyang Technological University |
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sg-ntu-dr.10356-54192023-03-11T17:10:42Z Development of compact thermal models for advanced electronic packages Xie, Ming. Toh, Kok Chuan School of Mechanical and Production Engineering DRNTU::Engineering::Manufacturing This study is aimed at developing compact models for advanced electronic packages, such as an area array e.g. Ball Grid Array (BGA), or flip chip type packages. Master of Engineering (MPE) 2008-09-17T10:50:05Z 2008-09-17T10:50:05Z 2002 2002 Thesis http://hdl.handle.net/10356/5419 Nanyang Technological University application/pdf |
| institution |
Nanyang Technological University |
| building |
NTU Library |
| continent |
Asia |
| country |
Singapore Singapore |
| content_provider |
NTU Library |
| collection |
DR-NTU |
| topic |
DRNTU::Engineering::Manufacturing |
| spellingShingle |
DRNTU::Engineering::Manufacturing Xie, Ming. Development of compact thermal models for advanced electronic packages |
| description |
This study is aimed at developing compact models for advanced electronic packages, such as an area array e.g. Ball Grid Array (BGA), or flip chip type packages. |
| author2 |
Toh, Kok Chuan |
| author_facet |
Toh, Kok Chuan Xie, Ming. |
| format |
Theses and Dissertations |
| author |
Xie, Ming. |
| author_sort |
Xie, Ming. |
| title |
Development of compact thermal models for advanced electronic packages |
| title_short |
Development of compact thermal models for advanced electronic packages |
| title_full |
Development of compact thermal models for advanced electronic packages |
| title_fullStr |
Development of compact thermal models for advanced electronic packages |
| title_full_unstemmed |
Development of compact thermal models for advanced electronic packages |
| title_sort |
development of compact thermal models for advanced electronic packages |
| publishDate |
2008 |
| url |
http://hdl.handle.net/10356/5419 |
| _version_ |
1761781975400579072 |