Development of compact thermal models for advanced electronic packages
This study is aimed at developing compact models for advanced electronic packages, such as an area array e.g. Ball Grid Array (BGA), or flip chip type packages.
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| Format: | Theses and Dissertations |
| Published: |
2008
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| Online Access: | http://hdl.handle.net/10356/5419 |
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| Institution: | Nanyang Technological University |
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