Ultrasonic evaluation of weak mold compound/silicon interfaces in IC packages

The quality of interfaces such as that between mold compound and silicon (MC/Si) is a critical issue in the reliability testing of IC packaging and during the manufacturing process. Common defects such as delamination can be detected using C-mode scanning acoustic microscopy with sufficient confiden...

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Bibliographic Details
Main Author: Yeo, Hwee Chung.
Other Authors: Guo, Ningqun
Format: Theses and Dissertations
Published: 2008
Subjects:
Online Access:http://hdl.handle.net/10356/5470
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Institution: Nanyang Technological University
Description
Summary:The quality of interfaces such as that between mold compound and silicon (MC/Si) is a critical issue in the reliability testing of IC packaging and during the manufacturing process. Common defects such as delamination can be detected using C-mode scanning acoustic microscopy with sufficient confidence. However, weak interfaces have often gone undetected and may become potentially defective at a later stage.