Ultrasonic evaluation of weak mold compound/silicon interfaces in IC packages
The quality of interfaces such as that between mold compound and silicon (MC/Si) is a critical issue in the reliability testing of IC packaging and during the manufacturing process. Common defects such as delamination can be detected using C-mode scanning acoustic microscopy with sufficient confiden...
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Main Author: | Yeo, Hwee Chung. |
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Other Authors: | Guo, Ningqun |
Format: | Theses and Dissertations |
Published: |
2008
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Subjects: | |
Online Access: | http://hdl.handle.net/10356/5470 |
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Institution: | Nanyang Technological University |
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