Ultrasonic evaluation of weak mold compound/silicon interfaces in IC packages

Ultrasonic evaluation of weak mold compound/silicon interfaces in IC packages

The quality of interfaces such as that between mold compound and silicon (MC/Si) is a critical issue in the reliability testing of IC packaging and during the manufacturing process. Common defects such as delamination can be detected using C-mode scanning acoustic microscopy with sufficient confiden...

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Main Author: Yeo, Hwee Chung.
Other Authors: Guo, Ningqun
Format: Theses and Dissertations
Published: 2008
Subjects:
DRNTU::Engineering::Manufacturing
Online Access:http://hdl.handle.net/10356/5470
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Institution: Nanyang Technological University
id sg-ntu-dr.10356-5470
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spelling sg-ntu-dr.10356-54702023-03-11T17:13:57Z Ultrasonic evaluation of weak mold compound/silicon interfaces in IC packages Yeo, Hwee Chung. Guo, Ningqun School of Mechanical and Production Engineering DRNTU::Engineering::Manufacturing The quality of interfaces such as that between mold compound and silicon (MC/Si) is a critical issue in the reliability testing of IC packaging and during the manufacturing process. Common defects such as delamination can be detected using C-mode scanning acoustic microscopy with sufficient confidence. However, weak interfaces have often gone undetected and may become potentially defective at a later stage. Master of Engineering (MPE) 2008-09-17T10:51:18Z 2008-09-17T10:51:18Z 2002 2002 Thesis http://hdl.handle.net/10356/5470 Nanyang Technological University application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
topic DRNTU::Engineering::Manufacturing
spellingShingle DRNTU::Engineering::Manufacturing
Yeo, Hwee Chung.
Ultrasonic evaluation of weak mold compound/silicon interfaces in IC packages
description The quality of interfaces such as that between mold compound and silicon (MC/Si) is a critical issue in the reliability testing of IC packaging and during the manufacturing process. Common defects such as delamination can be detected using C-mode scanning acoustic microscopy with sufficient confidence. However, weak interfaces have often gone undetected and may become potentially defective at a later stage.
author2 Guo, Ningqun
author_facet Guo, Ningqun
Yeo, Hwee Chung.
format Theses and Dissertations
author Yeo, Hwee Chung.
author_sort Yeo, Hwee Chung.
title Ultrasonic evaluation of weak mold compound/silicon interfaces in IC packages
title_short Ultrasonic evaluation of weak mold compound/silicon interfaces in IC packages
title_full Ultrasonic evaluation of weak mold compound/silicon interfaces in IC packages
title_fullStr Ultrasonic evaluation of weak mold compound/silicon interfaces in IC packages
title_full_unstemmed Ultrasonic evaluation of weak mold compound/silicon interfaces in IC packages
title_sort ultrasonic evaluation of weak mold compound/silicon interfaces in ic packages
publishDate 2008
url http://hdl.handle.net/10356/5470
_version_ 1761781915030913024

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