Ultrasonic evaluation of weak mold compound/silicon interfaces in IC packages
The quality of interfaces such as that between mold compound and silicon (MC/Si) is a critical issue in the reliability testing of IC packaging and during the manufacturing process. Common defects such as delamination can be detected using C-mode scanning acoustic microscopy with sufficient confiden...
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| 格式: | Theses and Dissertations |
| 出版: |
2008
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| 在線閱讀: | http://hdl.handle.net/10356/5470 |
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| 機構: | Nanyang Technological University |