Development of a failure assessment methodology for flip chip electronic assembly

In this project, two different solder bump materials are evaluated, they are lead-based 63Sn/37Pb solder and lead-free 96.5Sn/3.5Ag solder. Their solder joint fatigue lives on flip chip on board (FCOB) assembly are assessed by experimental testing and numerical modeling. FCOB assemblies are subjecte...

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Main Author:	Yeo, Alfred Swain Hong.
Other Authors:	Pang, John Hock Lye
Format:	Theses and Dissertations
Published:	2008
Subjects:	DRNTU::Engineering::Manufacturing
Online Access:	http://hdl.handle.net/10356/5476
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Institution:	Nanyang Technological University

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spelling	sg-ntu-dr.10356-54762023-03-11T17:07:55Z Development of a failure assessment methodology for flip chip electronic assembly Yeo, Alfred Swain Hong. Pang, John Hock Lye School of Mechanical and Production Engineering DRNTU::Engineering::Manufacturing In this project, two different solder bump materials are evaluated, they are lead-based 63Sn/37Pb solder and lead-free 96.5Sn/3.5Ag solder. Their solder joint fatigue lives on flip chip on board (FCOB) assembly are assessed by experimental testing and numerical modeling. FCOB assemblies are subjected to a temperature cycle test profile of -40/125°C. Failure analysis is performed to determine the failure mode and failure location. From the flip chip solder joint fatigue data, a two-parameter Weibull analysis is used to derive the mean time to failure (MTTF). Non-linear FE analysis is used to simulate the flip chip solder joint reliability under the temperature cycling loading condition, based on four different solder constitutive models, such as elastic-plastic, elastic-creep, elastic-plastic-creep and viscoplastic analyses. Master of Engineering (MPE) 2008-09-17T10:51:29Z 2008-09-17T10:51:29Z 2004 2004 Thesis http://hdl.handle.net/10356/5476 Nanyang Technological University application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
topic	DRNTU::Engineering::Manufacturing
spellingShingle	DRNTU::Engineering::Manufacturing Yeo, Alfred Swain Hong. Development of a failure assessment methodology for flip chip electronic assembly
description	In this project, two different solder bump materials are evaluated, they are lead-based 63Sn/37Pb solder and lead-free 96.5Sn/3.5Ag solder. Their solder joint fatigue lives on flip chip on board (FCOB) assembly are assessed by experimental testing and numerical modeling. FCOB assemblies are subjected to a temperature cycle test profile of -40/125°C. Failure analysis is performed to determine the failure mode and failure location. From the flip chip solder joint fatigue data, a two-parameter Weibull analysis is used to derive the mean time to failure (MTTF). Non-linear FE analysis is used to simulate the flip chip solder joint reliability under the temperature cycling loading condition, based on four different solder constitutive models, such as elastic-plastic, elastic-creep, elastic-plastic-creep and viscoplastic analyses.
author2	Pang, John Hock Lye
author_facet	Pang, John Hock Lye Yeo, Alfred Swain Hong.
format	Theses and Dissertations
author	Yeo, Alfred Swain Hong.
author_sort	Yeo, Alfred Swain Hong.
title	Development of a failure assessment methodology for flip chip electronic assembly
title_short	Development of a failure assessment methodology for flip chip electronic assembly
title_full	Development of a failure assessment methodology for flip chip electronic assembly
title_fullStr	Development of a failure assessment methodology for flip chip electronic assembly
title_full_unstemmed	Development of a failure assessment methodology for flip chip electronic assembly
title_sort	development of a failure assessment methodology for flip chip electronic assembly
publishDate	2008
url	http://hdl.handle.net/10356/5476
_version_	1761781245475291136

Development of a failure assessment methodology for flip chip electronic assembly

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