Development of a failure assessment methodology for flip chip electronic assembly
In this project, two different solder bump materials are evaluated, they are lead-based 63Sn/37Pb solder and lead-free 96.5Sn/3.5Ag solder. Their solder joint fatigue lives on flip chip on board (FCOB) assembly are assessed by experimental testing and numerical modeling. FCOB assemblies are subjecte...
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| 格式: | Theses and Dissertations |
| 出版: |
2008
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| 在線閱讀: | http://hdl.handle.net/10356/5476 |
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| 機構: | Nanyang Technological University |
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