Stress evaluation in thin films

Stress evaluation in thin films

We are in the midst of a major technology transition from alumni to copper as the metallization material. In the present study, a comprehensive examination of the change in the stress state due to this technology transition has been made, which is done by repeating the experiments that were done on...

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Bibliographic Details
Main Author: Lalita Varma P. V. S. N.
Other Authors: Ramamurthy, Upadrasta
Format: Theses and Dissertations
Published: 2008
Subjects:
DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films
Online Access:http://hdl.handle.net/10356/5925
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Institution: Nanyang Technological University
Description
Summary:We are in the midst of a major technology transition from alumni to copper as the metallization material. In the present study, a comprehensive examination of the change in the stress state due to this technology transition has been made, which is done by repeating the experiments that were done on aluminium and comparing the results when the same tests were done on copper.

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