Stress evaluation in thin films

We are in the midst of a major technology transition from alumni to copper as the metallization material. In the present study, a comprehensive examination of the change in the stress state due to this technology transition has been made, which is done by repeating the experiments that were done on...

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Main Author:	Lalita Varma P. V. S. N.
Other Authors:	Ramamurthy, Upadrasta
Format:	Theses and Dissertations
Published:	2008
Subjects:	DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films
Online Access:	http://hdl.handle.net/10356/5925
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Institution:	Nanyang Technological University

id	sg-ntu-dr.10356-5925
record_format	dspace
spelling	sg-ntu-dr.10356-59252023-03-11T17:00:49Z Stress evaluation in thin films Lalita Varma P. V. S. N. Ramamurthy, Upadrasta School of Mechanical and Production Engineering DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films We are in the midst of a major technology transition from alumni to copper as the metallization material. In the present study, a comprehensive examination of the change in the stress state due to this technology transition has been made, which is done by repeating the experiments that were done on aluminium and comparing the results when the same tests were done on copper. Master of Engineering (MPE) 2008-09-17T11:02:31Z 2008-09-17T11:02:31Z 2001 2001 Thesis http://hdl.handle.net/10356/5925 Nanyang Technological University application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
topic	DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films
spellingShingle	DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films Lalita Varma P. V. S. N. Stress evaluation in thin films
description	We are in the midst of a major technology transition from alumni to copper as the metallization material. In the present study, a comprehensive examination of the change in the stress state due to this technology transition has been made, which is done by repeating the experiments that were done on aluminium and comparing the results when the same tests were done on copper.
author2	Ramamurthy, Upadrasta
author_facet	Ramamurthy, Upadrasta Lalita Varma P. V. S. N.
format	Theses and Dissertations
author	Lalita Varma P. V. S. N.
author_sort	Lalita Varma P. V. S. N.
title	Stress evaluation in thin films
title_short	Stress evaluation in thin films
title_full	Stress evaluation in thin films
title_fullStr	Stress evaluation in thin films
title_full_unstemmed	Stress evaluation in thin films
title_sort	stress evaluation in thin films
publishDate	2008
url	http://hdl.handle.net/10356/5925
_version_	1761781897459924992

Stress evaluation in thin films

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