Dielectric bonding for semiconductor-on-insulator applications

• المؤلف الرئيسي: Ho, Chiak Ming
• مؤلفون آخرون: Tan Chuan Seng
• التنسيق: Final Year Project
• اللغة: English
• منشور في: 2014
• الموضوعات: DRNTU::Engineering::Electrical and electronic engineering
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/60417
• المؤسسة: Nanyang Technological University

This report investigates the dielectric bonding between two wafers each comprised of a thin film of Aluminium Nitride (AlN) deposited onto a Si substrate as well as the preparations required to ensure the success of the bonding. The two AlN and Si wafers will be brought together under direct contact...