Advanced wafer bonding for substrate engineering and 3D IC integration

• Main Author: Chong, Gang Yih
• Other Authors: Tan Chuan Seng
• Format: Theses and Dissertations
• Language: English
• Published: 2014
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
• Online Access: http://hdl.handle.net/10356/60478
• Institution: Nanyang Technological University

Three dimensional integrated circuits (3D ICs) in the form of several interconnected device layers which are stacked vertically offer a few advantages including improved device performance, form factor and heterogeneous integration. This thesis work is to develop an enabling process technology based...