Micro-machining of silicon and metals using femtosecond laser
The objective of this project is to investigate the application of femtosecond lasers to micromachining. Specifically, the effects of the femtosecond laser on silicon and metals will be explored. Two specific applications will be considered in this investigation, they are the dicing of silicon wafer...
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Main Authors: | , , , |
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Other Authors: | |
Format: | Theses and Dissertations |
Language: | English |
Published: |
2014
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Subjects: | |
Online Access: | http://hdl.handle.net/10356/60696 |
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Institution: | Nanyang Technological University |
Language: | English |