Micro-machining of silicon and metals using femtosecond laser

The objective of this project is to investigate the application of femtosecond lasers to micromachining. Specifically, the effects of the femtosecond laser on silicon and metals will be explored. Two specific applications will be considered in this investigation, they are the dicing of silicon wafer...

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Bibliographic Details
Main Authors: Koh, Wee Leong, Wang, Lei, Wong, Thai Yuan, Zhang, Yilei
Other Authors: Lam Yee Cheong
Format: Theses and Dissertations
Language:English
Published: 2014
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Online Access:http://hdl.handle.net/10356/60696
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Institution: Nanyang Technological University
Language: English

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