Micro-machining of silicon and metals using femtosecond laser

The objective of this project is to investigate the application of femtosecond lasers to micromachining. Specifically, the effects of the femtosecond laser on silicon and metals will be explored. Two specific applications will be considered in this investigation, they are the dicing of silicon wafer...

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Bibliographic Details
Main Authors: Koh, Wee Leong, Wang, Lei, Wong, Thai Yuan, Zhang, Yilei
Other Authors: Lam Yee Cheong
Format: Theses and Dissertations
Language:English
Published: 2014
Subjects:
Online Access:http://hdl.handle.net/10356/60696
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Institution: Nanyang Technological University
Language: English
Description
Summary:The objective of this project is to investigate the application of femtosecond lasers to micromachining. Specifically, the effects of the femtosecond laser on silicon and metals will be explored. Two specific applications will be considered in this investigation, they are the dicing of silicon wafers and manufacturing of metallic stents. The work done includes the optimization of the laser cutting process and an investigation of the key effects. A simulation of the laser cutting process on silicon was developed. The machining of a planer stent pattern using the femtosecond laser was also carried out.