Characterisation of thermosonic applications in wire bonding
In this work, the characterisation of the vibration profile of the bonding tool as a result of thermosonic application on a piezo-stacked transducer was studied. The work seeks to better understand the fundamental principles governing the structural response and dynamic response of a lead zirconate...
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2008
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| Online Access: | http://hdl.handle.net/10356/6164 |
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| Institution: | Nanyang Technological University |
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sg-ntu-dr.10356-61642023-03-11T17:08:38Z Characterisation of thermosonic applications in wire bonding Moey, Chin Hui. Butler, David Lee School of Mechanical and Aerospace Engineering DRNTU::Engineering::Manufacturing In this work, the characterisation of the vibration profile of the bonding tool as a result of thermosonic application on a piezo-stacked transducer was studied. The work seeks to better understand the fundamental principles governing the structural response and dynamic response of a lead zirconate titinate (PZT) crystal stack when exposed to small electrics fields. Master of Science (Precision Engineering) 2008-09-17T11:08:13Z 2008-09-17T11:08:13Z 2005 2005 Thesis http://hdl.handle.net/10356/6164 Nanyang Technological University application/pdf |
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Singapore Singapore |
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DRNTU::Engineering::Manufacturing |
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DRNTU::Engineering::Manufacturing Moey, Chin Hui. Characterisation of thermosonic applications in wire bonding |
| description |
In this work, the characterisation of the vibration profile of the bonding tool as a result of thermosonic application on a piezo-stacked transducer was studied. The work seeks to better understand the fundamental principles governing the structural response and dynamic response of a lead zirconate titinate (PZT) crystal stack when exposed to small electrics fields. |
| author2 |
Butler, David Lee |
| author_facet |
Butler, David Lee Moey, Chin Hui. |
| format |
Theses and Dissertations |
| author |
Moey, Chin Hui. |
| author_sort |
Moey, Chin Hui. |
| title |
Characterisation of thermosonic applications in wire bonding |
| title_short |
Characterisation of thermosonic applications in wire bonding |
| title_full |
Characterisation of thermosonic applications in wire bonding |
| title_fullStr |
Characterisation of thermosonic applications in wire bonding |
| title_full_unstemmed |
Characterisation of thermosonic applications in wire bonding |
| title_sort |
characterisation of thermosonic applications in wire bonding |
| publishDate |
2008 |
| url |
http://hdl.handle.net/10356/6164 |
| _version_ |
1761781802940235776 |