Development of failure criterion and reliability model for plastic encapsulated microcircuits at elevated environment

Development of failure criterion and reliability model for plastic encapsulated microcircuits at elevated environment

The strength of the interfaces between dissimilar materials that make up an electronic component has important consequence on its failure mechanism. The mechanical integrity of such devices is thus determined by a material property that characterizes the resistance of material interface to fracture....

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書目詳細資料
主要作者:	Poon, Wai Kiong.
其他作者:	Ang, Hock Eng
格式:	Theses and Dissertations
出版:	2008
主題:	DRNTU::Engineering::Manufacturing::Product engineering
在線閱讀:	http://hdl.handle.net/10356/6280
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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