Process development for flip chip BGA packages

• Main Author: Camenforte, Raymundo M.
• Other Authors: Zhong, Zhaowei
• Format: Theses and Dissertations
• Published: 2008
• Subjects: DRNTU::Engineering::Manufacturing
• Online Access: http://hdl.handle.net/10356/6319
• Institution: Nanyang Technological University

As the trend towards high performance electronic packaging continues, the introduction of a flip chip ball grid array (FC-BGA) package becomes more attractive to the electronic industry, due to its high packaging density, thermal and electrical performance. Some engineers and companies have already done numerous studies and evaluation of different variations of flip chip packaging, its materials, equipment, and improvement of its performance, and published their results and findings. However, few have published information on the methods and the way in which a flip chip BGA package is being developed or processed, especially for high volume production environment.