Process development for flip chip BGA packages

• Main Author: Camenforte, Raymundo M.
• Other Authors: Zhong, Zhaowei
• Format: Theses and Dissertations
• Published: 2008
• Subjects: DRNTU::Engineering::Manufacturing
• Online Access: http://hdl.handle.net/10356/6319
• Institution: Nanyang Technological University

As the trend towards high performance electronic packaging continues, the introduction of a flip chip ball grid array (FC-BGA) package becomes more attractive to the electronic industry, due to its high packaging density, thermal and electrical performance. Some engineers and companies have already...