Process development for flip chip BGA packages
As the trend towards high performance electronic packaging continues, the introduction of a flip chip ball grid array (FC-BGA) package becomes more attractive to the electronic industry, due to its high packaging density, thermal and electrical performance. Some engineers and companies have already...
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| Format: | Theses and Dissertations |
| Published: |
2008
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| Online Access: | http://hdl.handle.net/10356/6319 |
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| Institution: | Nanyang Technological University |