Nondestructive evaluation interfaces defects IC packaging

• Main Authors: Guo, Ningqun., Ling, Shih Fu., Wong, Brian Stephen.
• Other Authors: School of Mechanical and Production Engineering
• Format: Research Report
• Published: 2008
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
• Online Access: http://hdl.handle.net/10356/6966
• Institution: Nanyang Technological University

There are many interfaces in IC packaging, such as that between mold compound and silicon chip, and that between silicon die, die attach and copper lead-frame. The quality of these interfaces has been a critical issue in the reliability testing of IC packaging and during the manufacturing process as the packages become thinner and denser. Common defects such as delamination and crack can be detected using C-mode scanning acoustic microscope with sufficient confidence. However, weak interface due to weak adhesion has often gone undetected and may become potential defective area at a later stage. It is desirable to develop a more quantitative method to characterize the weak interface nondestructively, and this has been the motivation and focus of the study.