Nondestructive evaluation interfaces defects IC packaging

• Main Authors: Guo, Ningqun., Ling, Shih Fu., Wong, Brian Stephen.
• Other Authors: School of Mechanical and Production Engineering
• Format: Research Report
• Published: 2008
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
• Online Access: http://hdl.handle.net/10356/6966
• Institution: Nanyang Technological University

There are many interfaces in IC packaging, such as that between mold compound and silicon chip, and that between silicon die, die attach and copper lead-frame. The quality of these interfaces has been a critical issue in the reliability testing of IC packaging and during the manufacturing process as...