Development of copper nanoparticles for low temperature die-attach applications
Copper nanoparticles (Cu NPs) that are passivated with thin layers of amine-based organic materials is studied as a low temperature die attach material. Due to the high surface energy of these Cu NPs, they need a protection layer to prevent spontaneous fusion. However, it is important to have these...
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| 格式: | Theses and Dissertations |
| 語言: | English |
| 出版: |
2017
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| 主題: | |
| 在線閱讀: | http://hdl.handle.net/10356/72326 |
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