Development of copper nanoparticles for low temperature die-attach applications
Copper nanoparticles (Cu NPs) that are passivated with thin layers of amine-based organic materials is studied as a low temperature die attach material. Due to the high surface energy of these Cu NPs, they need a protection layer to prevent spontaneous fusion. However, it is important to have these...
Saved in:
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Theses and Dissertations |
| Language: | English |
| Published: |
2017
|
| Subjects: | |
| Online Access: | http://hdl.handle.net/10356/72326 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Institution: | Nanyang Technological University |
| Language: | English |