Development of copper nanoparticles for low temperature die-attach applications

• Main Author: Ng, Mei Zhen
• Other Authors: Gan Chee Lip
• Format: Theses and Dissertations
• Language: English
• Published: 2017
• Subjects: DRNTU::Engineering::Materials
• Online Access: http://hdl.handle.net/10356/72326
• Institution: Nanyang Technological University

Copper nanoparticles (Cu NPs) that are passivated with thin layers of amine-based organic materials is studied as a low temperature die attach material. Due to the high surface energy of these Cu NPs, they need a protection layer to prevent spontaneous fusion. However, it is important to have these...