Development of copper nanoparticles for low temperature die-attach applications

• 主要作者: Ng, Mei Zhen
• 其他作者: Gan Chee Lip
• 格式: Theses and Dissertations
• 語言: English
• 出版: 2017
• 主題: DRNTU::Engineering::Materials
• 在線閱讀: http://hdl.handle.net/10356/72326

Copper nanoparticles (Cu NPs) that are passivated with thin layers of amine-based organic materials is studied as a low temperature die attach material. Due to the high surface energy of these Cu NPs, they need a protection layer to prevent spontaneous fusion. However, it is important to have these...