Development of copper nanoparticles for low temperature die-attach applications

• المؤلف الرئيسي: Ng, Mei Zhen
• مؤلفون آخرون: Gan Chee Lip
• التنسيق: Theses and Dissertations
• اللغة: English
• منشور في: 2017
• الموضوعات: DRNTU::Engineering::Materials
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/72326

Copper nanoparticles (Cu NPs) that are passivated with thin layers of amine-based organic materials is studied as a low temperature die attach material. Due to the high surface energy of these Cu NPs, they need a protection layer to prevent spontaneous fusion. However, it is important to have these...