Mechanical characterization and analysis of thin-film stacked structures for microelectronic assembly

• المؤلف الرئيسي: Yeo, Swain Hong
• مؤلفون آخرون: Zhou Kun
• التنسيق: Theses and Dissertations
• اللغة: English
• منشور في: 2017
• الموضوعات: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films; DRNTU::Engineering::Materials::Material testing and characterization; DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/72665

The trend towards cost reduction, improved reliability, and increased functionality and performance in the power electronic product leads to a continuous implementation of new designs, materials, processes, and evaluation methodologies for chip- and package-level interconnections. Due to such trend,...